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Low volume PCB assembly in China with no MOQ, 24-hour prototypes, and one-stop turnkey solutions
1 Years
| Ask Lasest Price | |
| Supply Ability : | 100,000 pieces per month |
| Delivery Time : | 5-25 working days(varies by product) |
| Price : | Quote based on your specs |
| Payment Terms : | T/T |
When your project demands fast BGA assembly without compromising quality, Studio Electronics delivers Express BGA Assembly with fast PCB assembly service. As a responsive provider of PCB assembly in China, we combine specialized BGA process expertise, 12 automated SMT lines, and advanced X-Ray inspection to deliver reliable BGA assemblies fast. Our complete turnkey service covers component procurement through final shipping, with 100% X-Ray verification on every board—even for express orders.
| Service Element | Express Capability | Quality Assurance |
|---|---|---|
| Component Sourcing | Rapid procurement; Smart Material Rack allocation | Incoming inspection; traceability |
| BGA Placement | 12 SMT lines with priority scheduling | ±25μm accuracy; vision alignment |
| Reflow | Pre-validated profiles; rapid profile development | Controlled reflow; nitrogen option |
| X-Ray Inspection | 2D and 3D X-Ray; priority inspection | 100% coverage; void analysis |
| Testing | Flying Probe; FCT—rapid testing | Electrical verification; functional testing |
| Shipping | Expedited shipping; global logistics | Anti-static packaging; tracking |
Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Smart Material Rack enables
rapid component allocation.
Stage 2: SMT Assembly
12 SMT lines with priority scheduling. Quick-changeover capability.
BGA placement with ±25μm accuracy.
Stage 3: Controlled Reflow
Pre-validated reflow profiles. Rapid profile development for new
BGA packages. Nitrogen reflow available.
Stage 4: X-Ray Inspection (100% Coverage)
Priority X-Ray inspection scheduling. 2D X-Ray for ball alignment
and bridging; 3D X-Ray for void analysis. Rapid void calculation.
Stage 5: Testing & Final Assembly
Flying Probe testing; FCT for functional verification. Careful
handling; anti-static packaging; expedited shipping with tracking.
Speed – Fast turnaround for time-sensitive projects
Quality – 100% X-Ray verification on every board
Expertise – Specialized BGA process knowledge
Complete Service – Sourcing through assembly and shipping—one point of contact
Low Volume Support – Express service for low volume PCB assembly and prototypes
Studio delivers Express BGA Assembly—fast PCB assembly service with 100% X-Ray verification on every BGA board.
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